低温共烧陶瓷,LTCC英语短句,例句大全

低温共烧陶瓷,LTCC
1)LTCC低温共烧陶瓷
1.Researches and Development of Borosilicate Glass in LTCC Technology;低温共烧陶瓷用硼硅酸盐玻璃的研究进展
2.Current Status and Developmental Trend of LTCC;低温共烧陶瓷的现状和发展趋势
3.Soldering of SiC particulate reinforced aluminum(Al/SiC) and low temperature co fired ceramic (LTCC) materials;铝基碳化硅增强材料(Al/SiC)和低温共烧陶瓷(LTCC)的钎焊

英文短句/例句

1.The Research of Low Temperature Co-fired Ceramic(LTCC) Technology Manufacturing Process低温共烧陶瓷(LTCC)工艺的研究
2.The Mathematics Model of LTCC Sintering Furnace Temperature Field低温共烧陶瓷专用烧结炉温度场的数学模型
3.A Ku-band Low Noise Amplifier Based on LTCC Technology基于低温共烧陶瓷技术的Ku波段低噪声放大器
4.Investigation on Measurements of LTCC Dielectric Constant Using Ring Resonator谐振环测量低温共烧陶瓷介电常数研究
5.New Technology for Preparing LTCC Green Tapes with Aqueous Tape Casting水基流延法制备低温共烧陶瓷生带材料新工艺
6.Study of Fabrication and Properties on MgO-Al_2O_3-SiO_2 Green Tape for LTCC;MgO-Al_2O_3-SiO_2系低温共烧陶瓷生带的制备及其性能研究
7.Study of the Design Method of Microstrip Filters and Balun Module Based on LTCC Technology;基于低温共烧陶瓷技术的微带滤波器和巴仑模块设计方法研究
8.Study on LTCC of BNT System Ceramic Materials;低温共烧（LTCC）BNT系统陶瓷材料研究
9.Study of the Properties of CaF_2-AlF_3-SiO_2 Oxyfluoride Glass-Ceramic SystemCaF_2-AlF_3-SiO_2系低温共烧氧氟玻璃陶瓷性能
10.Research progress of microwave dielectric ceramic materials for low temperature co-fired ceramic technology低温共烧微波介质陶瓷材料研究进展
11.Low-Temperature Sintering of ZnNb_2O_6 Ceramics;ZnNb_2O_6陶瓷的低温烧结研究
12.LOW FIRING SINTERING OF BaTi_4O_9 DIELECTRIC CERAMICSBaTi_4O_9介电陶瓷的低温烧结
13.Study on Preparation, Properties and Mechanism of Low-Temperature Co-fired Glass Ceramic Materials;低温共烧玻璃陶瓷材料的制备及性能、机理研究
14.A Middle Permittivity Microwave Dielectric Materials Based on BaO-TiO_2-Nb_2O_5 System for Low Temperature Co-fired Ceramics中介电常数BaO-TiO_2-Nb_2O_5体系低温共烧微波介质陶瓷
15.Low-temperature Co-firing Compatibility of ZnO-TiO_2 System Dielectrics/NiZnCu Ferrite Multilayer Composite;ZnO-TiO_2系介电陶瓷/NiZnCu铁氧体叠层低温共烧兼容特性研究
16.Study on Low-temperature Co-fired Microwave Ceramics with Middle Dielectric Constant and the Component;中介电常数低温共烧微波介质陶瓷及其器件研究
17.The Low-temperature Cofiring Properties of Ferroelectrics/NiZn Ferrite Multilayer Composite;高介弛豫铁电陶瓷/NiZn铁氧体叠层低温共烧行为的研究
18.Experiment study on AlN ceramics low-temperature sintering aids氮化铝陶瓷低温烧结助剂体系的研究

相关短句/例句

low temperature co-fired ceramic低温共烧陶瓷
1.Research on the low temperature co-fired ceramic material technique;低温共烧陶瓷材料工艺研究
2.The Research of Low Temperature Co-fired Ceramic(LTCC) Technology Manufacturing Process低温共烧陶瓷(LTCC)工艺的研究
3.The low temperature co-fired ceramic (LTCC) technique,which is an excellent packaging technique for achieving miniature and chip actualization of electronic components,has become a major method for electronic component integration,and has attracted the attention of many researchers.低温共烧陶瓷(low temperature co-fired ceramic,LTCC)技术是实现电子元件小型化、片式化的一种理想的封装技术,已成为电子元件集成的主要工艺方式,引起了人们的广泛关注。
3)Low temperature Co-fired ceramics低温共烧陶瓷
1.This paper reviews the application and research progress of low temperature co-fired ceramics (LTCC)materials.主要概述了低温共烧陶瓷(Low Temperature Co-fired Ceramics,简称 LTCC)材料的应用和研究现状,认为利用低温共烧陶瓷技术将多种元器件复合或将其集成在多层陶瓷基板中是今后信息功能陶瓷发展的一个重要方向,在我国应大力发展具有自主知识产权的 LTCC 技术。
2.The low temperature co-fired ceramics(LTCC)technology developed in recent years is an integrat- ed technology of electric components.低温共烧陶瓷技术是近年发展起来的令人瞩目的整合组件技术,已经成为无源集成的主流技术,成为无源元件领域的发展方向和新元件产业的经济增长点。
3.A new technology of aqueous tape casting process has been developed to produce borosilicate glass-ceramic based low temperature co-fired ceramics(LTCC) green tapes for its low cost,safety and no toxicity advantage with water-based latex as binder.为实现硼硅酸盐玻璃陶瓷基低温共烧陶瓷生带材料的低成本、安全无毒化生产,采用以水性乳胶作为粘结剂的水基流延工艺进行制备;采用数字旋转黏度计分别对分散剂、固相、粘结剂含量对浆料黏度的影响进行了研究,利用扫描电镜对烧结前后生带材料的微观形貌进行了分析。
4)low temperature cofired ceramics低温共烧陶瓷
1.Discuss is the development of the low temperature cofired ceramics of series B 2 O 3 -P 2 O 5 -SiO 2 .讨论B2O3-P2O5-SiO2系低温共烧陶瓷的研究过程。
2.Equivalent cavity model based on low temperature cofired ceramics(LTCC) is put forward to realize package of the miniaturized transmission/receive module in Ka band.为了能够在Ka波段采用低温共烧陶瓷(LTCC)技术实现收发组件小型化设计,提出了LTCC无源等效腔体模型。
5)low temperature co-fired ceramic(LTCC)低温共烧陶瓷
1.Based on the low temperature co-fired ceramic(LTCC)technology,the silicon accelerometer,signal processing circuit,A/D convertor and RS422 interface cell are integrated in it.采用低温共烧陶瓷(LTCC)工艺将敏感元件、信号调理电路、模数转换电路和接口电路集成于一体,集成后的体积为45mm×45mm×15mm,实现了传感器的数字化、小型化和模块化,并大大提高了系统的测量精度和可靠性。
6)Low Temperature Co-fired Ceramic (LTCC)低温共烧陶瓷(LTCC)