可焊性,weldability英语短句,例句大全

可焊性,weldability
1)weldability可焊性
1.Composition Evolution and Weldability Improvement of 11MnNiCrMoV Steel plates;11NiCrMoV钢成分演变与可焊性改善途径
2.Study of Weldability of 15X1M1φ Heat Resistant Steel;15XlMlΦ耐热钢可焊性研究
3.Quality analysis of the weldability of gold electro-plated contact body of connector;接插件镀金接触体可焊性质量分析

英文短句/例句

1.Excellent in solderability and high heat resistance with either flow or reflow soklering.可焊性和耐焊性优，适用于流焊和再流焊。
2.Test method of solderability for printed boardsGB/T4677.10-1984印制板可焊性测试方法
3.Test methods of precious metal pastes used for thick-film microelectronics--Test of solderability and solderleaching resistanceGB/T17473.7-1998厚膜微电子技术用贵金属浆料测试方法可焊性、耐焊性试验
4.Study of the Reliability of Power Device with Lead-free Heat-sink Attachment;功率器件无铅焊料焊接层可靠性研究
5.Effect of Solder Pad Size on Solder Joint Reliability upon Flip Chip PBGA Packages焊盘尺寸对FC-PBGA焊点可靠性的影响
6.Research on Feasibility of WB36 Steel Welding Process Using Domestic Welding Electrode国产焊条焊接WB36钢的工艺可行性研究
7.The welding technic on the rectifier diode connection for improving reliability.元件板二极管的焊点采用熔焊技术，增加可靠性。
8.Research on Reliability of SMT Soldered Joints and FEM Analysis of CBGA Soldered Joints;SMT焊点的可靠性研究及CBGA焊点有限元分析
9.Impact of Stencil for Flip-Chip Shape and Their Reliability Study模板对倒装焊焊点形态的影响及其可靠性研究
10.Influence of Phosphorus on Reliability of Interface between Au/Ni/Cu Pad and SnAgCu Solder JointP对Au/Ni/Cu焊盘与SnAgCu焊点焊接界面可靠性的影响
11.Metals also possess the important property of being welsable金属也具有可焊接的重要特性。
12.A Few Measures for Increasing The Reliability of The Transistor Arc Welding Inverter提高晶体管弧焊逆变器可靠性的措施
13.Study on Welding Technology and Reliability of X80 Pipeline Steel;X80管线钢焊接工艺及可靠性研究
14.A Study of Interconnection Reliability for Low-temperature Sintered Nano-silver Paste;纳米银焊膏低温烧结粘接可靠性研究
15.Research Status and Prospect for 80Au-20Sn Solder Joint Reliability80Au-20Sn钎料焊点可靠性研究现状与展望
16.Finite element analysis on soldered joint reliability of QFN deviceQFN封装焊点可靠性的有限元分析
17.Reliability analysis of PBGA soldered joints based on Taguchi method基于田口法的PBGA器件焊点可靠性分析
18.Finite element analysis on reliability of lead-free soldered joints for CSP deviceCSP器件无铅焊点可靠性的有限元分析

相关短句/例句

solderability[,s?ld?r?'bil?ti]可焊性
1.Study on solderability of tin deposit by pulse plating;脉冲电镀锡层可焊性的研究
2.The Friction Stir Welding Solderability of the High Strength Al Alloy Plate;高强铝合金厚板搅拌摩擦焊可焊性分析
3)solderability[,s?ld?r?'bil?ti]可焊性;可焊度
4)Weldability可焊接性
5)solderable nickel可焊性镍
6)high solderability高可焊性
1.The tin-base plating technology on aluminum and aluminum alloy was recommended for its high anti-tarnish, high adhesion force and high solderability.重点对比了用浸锌、浸镍和磷酸阳极氧化两种铝及铝合金电镀前处理方法得到的锡基镀层的孔隙率、结合力、抗高温高湿性能、抗中性盐雾试验性能 ,分析了铝及铝合金锡基镀层在长期贮存过程中易变色、生霉、泛黑的原因 ,推荐了一种在铝及铝合金上电镀高抗变色性、高结合力、高可焊性的锡基镀层工艺。