钎焊性,solderability英语短句,例句大全

钎焊性,solderability
1)solderability[,s?ld?r?'bil?ti]钎焊性
1.The reasons of lower solderability and spreading rate of molten lead free solders on copper base metal have been discussed from thepoint of view of phase relations and phase reactions.从熔融钎料与母材的相关系和相反应(phase relation and phase reaction)出发,讨论了无铅钎料在铜上铺展率和钎焊性低下的原因,认为是其间过度和过于快速的金属间化合物生长所致。
2.The test results show that the modifying solder has good solderability,whereas,the excellent flux is rosin-ethanol or rosin-isopropanol solution.在熔融状态下无铅焊料合金的行为是影响电子产品微连接钎焊性的关键因素。
3.The influences of cathode current density, pH value, and temperature on the performance of the coating were investigated, while the correlation among the Cr content in the plating and the corrosion resistance and solderability was explored.以工业级的革鞣剂和硫酸镍为主盐,研究了硫酸盐体系电镀铬镍合金工艺配方与工艺规范、阴极电流密度、pH值、温度对镀层的影响,讨论了镀层中的铬含量对镀层耐腐蚀性和钎焊性的影响。

英文短句/例句

1.Study on Processing Technology and Brazing Performance of Ag55Cu21Zn17Sn5Ge2 SolderAg55Cu21Zn17Sn5Ge2钎料加工工艺及其钎焊性能的研究
2.Study on Mechanical Property and Solder ability of SnAgCu System Lead-free Solder AlloySnAgCu系无铅钎料合金力学性能及钎焊性能研究
3.The Experimental Research on Brazing Process of Fe_3Al and High Temperature Heat-resistant AlloyFe_3Al与高温耐热合金的钎焊性能研究
4.Study on the new type soldering acid and filler metal for restoration of ancient bronze;古代青铜器修复钎焊用钎剂与钎料的改性研究
5.The Research on Properties and Bonding Mechanism of Armorphous Cu-P Filler Metals;非晶Cu-P钎料的性能及钎焊机理研究
6.A Study on the Active Brazing of AlN to W-Cu Alloy with Ag-Ti_4 Active Filler AlloyAg-Ti_4活性钎料钎焊AlN与W-Cu合金研究
7.Characteristics of Amorphous Brazing Ribbon of Cu-P Based Alloy非晶态铜磷钎料真空钎焊紫铜的性能
8.Study on Weldability and Microstructure of Brazing Cubic Boron Nitride;钎焊立方氮化硼的焊接性与微观结构
9.Weldability and Microstructure of Copper Joints Welded by Two Kinds of Phosphor-copper Brazing Filler Metal两种铜磷钎料对紫铜钎焊的焊接性能和焊缝组织对比
10.Research on the New Lead-Free Solder Processing Properties of Brazing and Mechanical Properties;新型无铅钎料钎焊工艺性及机械性能的研究
11.Microstructure and properties of BCu80Ni5SnTi active filler metal for brazing cubic boron nitride钎焊立方氮化硼BCu80Ni5SnTi活性钎料的组织与性能
12.Study on Preparation and Brazing Diamond Film of Active Coated Brazing Filler Metal;活性涂层钎料的制备及其钎焊金刚石膜的研究
13.Effect of Cr on Property of Stainless Steel Joint Brazed with Series Ni-P Filler MetalCr对Ni-P系钎料钎焊不锈钢接头性能的影响
14.Influence of Cu on Properties of Zn-Al Solders for Al/Cu BrazingCu元素对铝/铜钎焊用Zn-Al钎料性能的影响
15.Microstructure and Mechanical Property of Joint by Amorphous Fillers非晶镍基钎料钎焊接头性能及微观组织的研究
16.Study on Soldering Procedure and Joint Properties of Down Quenching SnAgCu Solder Alloy急冷型SnAgCu系钎料合金钎焊工艺及接头性能研究
17.Research the Influence on Mechanics Performance of Jointing Techniques Parameter钎焊工艺参数对钎缝组织性能影响的研究
18.Phase Constitution of Soldering Seam and Mechanical Properties of Zn Matrix Filler Metal Soldering Magnesium Alloy AZ31B JointZn基钎料钎焊镁合金AZ31B接头的钎缝物相及力学性能

相关短句/例句

Brazability钎焊性
1.Improvement of joint brazability of aluminum alloys to stainless steel in the air铝合金与不锈钢大气钎焊性的改善——铝合金与不锈钢焊接技术(二)
2.Under torch brazing condition, using brazing filler metals of Cu-based and Ag-based, a series of tests are investigated to braze Ti(C,N) based cermets and 45 steel, the micrographic structure of joints and shearing test results are analyzed, they show that Ti(C,N) based cermets has good brazability.通过观察和分析钎焊接头的结合情况及剪切试验 ,表明 Ti(C,N)基金属陶瓷具有较好的钎焊性 ;火焰钎焊条件下 ,以 H 6 2为钎料的接头的平均剪切强度为37MPa,以 BAg10 Cu Zn为钎料的接头的剪切强度达 114 MPa,以 BCu Zn Mn为钎料的接头的平均剪切强度为 4 9MP
3)active brazing活性钎焊
1.Interfacial reaction of active brazing between Al_2O_3 ceramic and metal NiAl_2O_3陶瓷与金属Ni活性钎焊界面反应
2.Thermal cycle resistance of Al2O3/Ni-Ti/Kovar joints was studied, which were prepared by active brazing technique.对采用活性钎焊的Al2O3/Ni-Ti/Kovar(可伐)接头进行了考察,实验结果显示,接头经热循环后强度异常增加。
3.The active brazing of ceramics(Al_2O_3,ZrO_2andSi_3N_4)to ceramics and to 18-8 stainless steel was performed using Ag-Cu-Ti filler in a vaccum.研究了Ａｌ＿２Ｏ＿３、９３％Ａｌ＿２Ｏ＿３、Ｓｉ＿３Ｎ＿４和ＺｒＯ＿２陶瓷与陶瓷、陶瓷与不锈钢活性钎焊。
4)Solderability[,s?ld?r?'bil?ti]钎焊性能
1.The solderability of electronic solders depends to a great extent on the wettability, which relates to solid, liquid and gas interfacial tensions of the melted solders on substrates.钎料的钎焊性能很大程度取决于钎料对基板上的润湿性能,而润湿性能与液态钎料在基板上的液、固、气三相界面的界面张力有关。
2.The effect of the content of copper on melting point,strength,solderability is emphatically discussed.着重讨论了微量Ｃｕ含量对Ｚｎ－Ａｌ钎料熔点、强度、钎焊性能等的影响。
3.The solderability of electronic solders and some factors that influence the solderability are discussed.讨论了电子软钎料的钎焊性能及其影响因素,钎料的钎焊性能很大程度取决于钎料对基板的润湿性能,而润湿性能与液态钎料在基板上的液、固、气三相界面张力有关。
5)brazing characteristics钎焊特性
1.Vacuum brazing characteristics of Ni(80- x)Cr10B2.5Fe3Cux合金钎料真空钎焊1Cr18Ni9Ti的钎焊特性,并对铜的影响进行了探讨。
6)vacuum brazing / active brazer真空钎焊/活性钎料