焊锡材料,Soldering-tin英语短句,例句大全

焊锡材料,Soldering-tin
1)Soldering-tin焊锡材料
1.Determing of the Content of Tin and Lead in Soldering-tin by Spectro-photometra;原子吸收分光光度法测定焊锡材料中的锡和铅
2)solder[英]['s??ld?(r)][美]['sɑd?]焊料;焊锡
3)tin solder锡焊料
1.Determination of mercury in tin solder by microhydride generation-atomic absorption spectrometry;微型氢化物发生-原子吸收光谱法测定锡焊料中汞
2.Besides,some problems that confront tin solder sector after China's WTO accession shall be properly dealt with.本文阐述了锡市场形势,包括国内生产、锡的消费及后市预测,说明了加入WTO后对我国锡工业发展的影响,最后提出了锡焊料行业入世后需要适应的几个问题。
3.Digital photography and AutoCAD were used at the same time to calculate the spreading area of tin solder without the need of using other instrument.采用数码摄影技术与AutoCAD软件结合,探讨一种无需专用仪器测量锡焊料铺展性试验试件铺展面积的方法。

英文短句/例句

1.Tin-lead solder in the manufacture of professional audio equipment.用于制造专业音响设备的铅锡焊料。
2.Inventory of special ICS having tin-lead solder on/in leads/balls, used in specialist/professional equipment.用于专业设备，含有铅锡焊料的积体电路。
3.Sn-Pb soldering used in Ground-based Aeronautical Communication Equipment Manufacturing.用于地基航空通讯设备制造业的铅锡焊料。
4.Transducers used in professional loudspeaker systems, using tin-lead solder.用于专业扬声器系统，含有铅锡焊料的变换器。
5.tin-lead 60-40 solder锡铅60-40焊料
6.Pb-free solders ? Sn-Bi-Zn based with our own patent and their modification to fit for package applications.无铅焊锡—锡铋锌系无铅焊锡，材料设计、开发，焊料（锡球、锡膏）开发等。
7.Pb-free solders– Sn-Bi-Zn based with our own patent and their modification to fit for package applications.无铅焊锡—锡铋锌系无铅焊锡，材料设计、发，焊料（球、膏）发等。
8.Casting tin-lead soldersGB/T8012-1987铸造锡铅焊料
9.Sterling aluminium solder斯特林锡锌铝合金焊料
10.Soldering materials are our major products, especially in Lead Free Soldering Materials.焊锡物料是我们的主要产品，特别是无铅焊锡物料。
11.High precision welding materials pure tin lead alloy products.高级精密焊接纯锡铅合金材料制品。
12.Constitutive Description of Tin-Lead Solder 63Sn-37Pb under Multiaxial Loading;多轴加载下焊锡钎料63Sn-37Pb的本构描述
13.Electronic Hanliao; Electronic help of welding materials production; Research and development of new electronic materials; Tin welding materials; Electronic components; Electronic marketing tools.电子焊料；电子助焊材料生产；新型电子材料研制开发；锡焊材料；电子元器件；电子工具销售。
14.Tin-lead solders-Determination of tin content-Potassium iodate titrimetric methodGB/T10574.1-1989锡铅焊料化学分析方法碘酸钾滴定法测定锡量
15.Simultaneous Dissolution of Tin and Slive in Copper Solder and Determination by ICP-AES同时溶解和ICP-AES同时测定铜基锡银焊料中的锡和银
16.Experimental Study on Cyclic Behavior of Eutectic Tin-Lead Solder under Multiaxial Loading;多轴载荷下共晶锡铅焊料的循环性能实验研究
17.Mechanical Properties and Low Cycle Fatigue Life of Solder under Multiaxial Loading;焊锡钎料的多轴力学性能与低周疲劳寿命研究
18.Corrosion Research of Different Lead Free Wave Solder Pot Materials;无铅波峰焊不同锡炉材料溶蚀行为研究

相关短句/例句

solder[英]['s??ld?(r)][美]['sɑd?]焊料;焊锡
3)tin solder锡焊料
1.Determination of mercury in tin solder by microhydride generation-atomic absorption spectrometry;微型氢化物发生-原子吸收光谱法测定锡焊料中汞
2.Besides,some problems that confront tin solder sector after China's WTO accession shall be properly dealt with.本文阐述了锡市场形势,包括国内生产、锡的消费及后市预测,说明了加入WTO后对我国锡工业发展的影响,最后提出了锡焊料行业入世后需要适应的几个问题。
3.Digital photography and AutoCAD were used at the same time to calculate the spreading area of tin solder without the need of using other instrument.采用数码摄影技术与AutoCAD软件结合,探讨一种无需专用仪器测量锡焊料铺展性试验试件铺展面积的方法。
4)silver-tin solder银锡焊料
1.Determination of trace lead in silver-tin solder with flame atomic absorption spectrum;火焰原子吸收光谱法测定银锡焊料中的微量铅
5)Tin Solder锡基焊料
1.Determination of Stibium in Tin Solder by Flame Atomic Absorption Spectrometry;火焰原子吸收光谱法测定锡基焊料中锑
6)tin-lead solders锡铅焊料
1.Accordling to the basic principle of GB10574-89,the method of determination of tin in tin-lead solders was studied further.本文根据GB10 5 74- 89《碘酸钾滴定法测定锡量》的基本原理 ,对锡铅焊料中锡的测定方法做了进一步探讨。