Contact stress distribution接触区应力分布
3)distribution of contact pressure垫片接触应力分布
4)contact angles接触角分布
5)distribution of contact forces接触力分解
6)contact pressure distribution接触压强分布
1.Then,the contact pressure distribution was calculated and analyzed in polishing experiments using ANSYS.为了获得单晶硅片化学机械抛光过程中护环对接触压强分布的影响规律,从有护环化学机械抛光实际出发,建立了抛光过程的接触力学模型和边界条件,利用有限元法对有护环抛光接触状态时的接触压强分布进行了计算和分析,并利用抛光实验对计算获得结果进行了验证。
2.In order to obtain the effect of carrier film on contact pressure distribution in the chemical-mechanical polishing(CMP) of silicon wafer,a mechanism model and a boundary equation were set up,then the contact pressure distribution was calculated and analyzed by use of finite element method,and the calculated result was verified by polishing experiments.为了获得单晶硅片化学机械抛光过程中背垫对接触压强分布的影响规律,建立了有背垫抛光过程的接触力学模型和边界条件,利用有限元方法进行了有背垫时的接触压强分布的计算与分析,并利用抛光实验对计算结果进行了验证,获得了硅片与抛光垫的接触表面压强分布形态,以及背垫的物理参数对压强分布的影响规律。
3.In order to obtain the contact pressure distribution and its effect on the flatness errors of aluminum hard magnetic disc substrates,based on the lapping practices of the substrates,the elastic contact mechanical model and boundary conditions between the substrate and PVA fixed abrasive stones are established when the substrate is lapped.目的为了获得铝质硬磁盘基片研磨过程中的接触压强分布对基片平面度的影响规律。
延伸阅读
赤力力1.亦作"赤历历"。 2.象声词。
