锡须,tin whisker英语短句,例句大全

锡须,tin whisker
1)tin whisker锡须
1.Growth of tin whisker on lead-free solder coated leads of flexible printed circuit;挠性电路板引脚嵌合部无铅镀层的锡须生长
2.Research progress of growth mechanism of tin whisker;锡须生长机理的研究进展
3.Formation mechanism、hazard and suppress measures of tin whisker锡须的形成机理、危害及抑制措施

英文短句/例句

1.Tin Whisker Growth of Sn and SnPb Thin FilmsSn及SnPb薄膜表面锡须生长研究
2.Research progress on tin whisker growth in dampheat storage environment湿热存储环境下锡须生长的研究进展
3.Tin whiskers, growing spontaneously from Sn and Sn alloy coatings, can cause electrical shorts in the circuit and present a long-term reliability problem to the electronic industry.锡须，一种自发从锡和锡合金层生长出来的现象，它会导致电路短路,影响电子产品长期的可靠性。
4.The usual shapes and lengths of tin whisker in electronic integrated circuit (ECI) encapsulation industry were introduced.介绍了电子集成电路封装行业中常见的锡须的形状及长度。
5.This workshop will provide an overview of the vast literature and the latest development in tin whisker research, from the understanding of the mechanism to the remedies for whisker minimization.本讲座将对于此有关的大量文献作一概述并且介绍锡须研究的最新成果，包括锡须机理及其抑制。
6.The most obvious is the necessity for increased reflow temperature.最明显的是，使用无铅锡膏必须提高回流焊温度。
7.It is critical to excavate the tour resource thoroughly and to collocate it in reason,making out the explotiation unification programs.欲合理配置资源，苏锡旅游景观开发须统一规划。
8.Morphologies and characteristics of tin whiskers on surface of SnAgCuCe/Er lead-free solderSnAgCuCe/Er无铅钎料表面锡晶须的形态及特性
9.If granulated tin is used the reaction may have to be initiated by careful warming.如果所用的是粒状锡，那么须靠小心加温来引起反应。
10.Interface and Performance of SnO_2-Coated Magnesium Borate Whisker-Reinforced Aluminum Matrix Composite氧化锡涂覆硼酸镁晶须增强铝基复合材料的界面与性能
11.The goods be to be packed in tin - lined cases, and the contents of each case clearly marked on the outside .一切货物均须用内衬马口铁或锡纸的木箱包装，且外壳必须清楚地标明其内所装物品。
12.Of, containing, or yielding tin.锡的含锡的或产锡的
13.Of, relating to, or made of tin.锡制的锡的，与锡有关的或由锡制成的
14.Factors, which must be taken into consideration, include the type of alloy, the size of the solder powder and the type of flux.下列因素是必须被考虑的：包括合金的类型、锡粉的粒径大小以及助焊剂的类型。
15.Liu Chen-weng s Acceptance to Liu Yu-xi s Personality Spirit that Reflected from "a Person Who Returns to a Place He Once Abandoned" the Literary Reference in "Xu Xi" Lyrics;三生似是刘宾客——从须溪词中“前度刘郎”典故的使用看刘辰翁对刘禹锡的人格接受
16.tinfoil capsule(酒瓶的)锡箔帽，锡箔套
17.kanner's tinplate肯纳薄锡层镀锡薄钢板
18.best coke tin plate最优薄锡层镀锡薄钢板

相关短句/例句

whisker[英]['w?sk?(r)][美]['w?sk?]锡须
1.Analyse and prove the principle of whisker growth.本文介绍了近年来电子工业中锡和锡铅合金电镀的应用情况,探讨了各种替代Sn-Pb合金的无铅可焊性合金镀层,并对这些工艺做出了评价,分析论证了锡须生长的原理,指出了无铅可焊性电镀的发展方向。
3)tin whiskers锡须
4)Tin whisker锡晶须
1.However,it suffers from some problems such as tin whisker,surface color changes and bath mudding.但纯锡电镀中存在着许多问题,如锡晶须、镀层变色及镀液混浊等。
2.Therefore,it is imperative to investigate tin whisker growth mechanism,to look for the effective mitigation strategies and suitable accelerating test methods to study and assess the reliability of the electronic device.全球电子封装行业的无铅化趋势,使得镀层锡晶须自发生长的问题变得十分突出。
5)tin whiskers锡晶须
1.Morphologies and characteristics of tin whiskers on surface of SnAgCuCe/Er lead-free solderSnAgCuCe/Er无铅钎料表面锡晶须的形态及特性
6)Sn-Ni-coated Calcium-magnesium silicate whisker镀锡镍硅酸钙镁晶须