TLP平台,TLP
1)TLPTLP平台
1.Stress verification of a TLP under extreme wave environment极端环境条件下TLP平台的应力校核(英文)
2.According to the parameters of the center of gravity and weight given in the report of"The General Configuration and Weight Control of New Concept TLP in deep water",the analysis of intact stability and damaged stability are presented in this report.我们在前期的研究工作中,确定了新型深水TLP平台的主尺度、重量控制等参数,本研究根据这些参数对自由浮态下的TLP平台进行了完整稳性的计算分析,得到该平台均符合规范的结果。
英文短句/例句

1.Stress verification of a TLP under extreme wave environment极端环境条件下TLP平台的应力校核(英文)
2.An oil platform.钻井平台石油钻井平台
3.production platforms, including recovery platforms, treating platforms, living platforms and beacon towers;生产平台,包括采油平台、处理平台、生活平台和烽火台;
4.Research of Transient Liquid Phase Joining Machine for Oil-pipeline Welding;管道的瞬时液相扩散焊(TLP)焊机研究
5.The Investigation of the Effect of TLP on Hepatocellualr Growth;TLP对肝脏细胞生长的影响作用研究
6.Study of TLP Bonding Technology and Property for Dssimilar Steel Tubes of 12Cr2MoV and TP304H12Cr2MoV/TP304H异种钢管TLP连接工艺与性能研究
7.Influence of Welding Temperature on Property of 10Cr9Mo1VNb Steel TLP Joint焊接温度对10Cr9Mo1VNb钢TLP接头性能的影响
8.Microstructure and Properties of TLP and TIG+MIG Joint of T91 Steel PipeT91钢管TLP与TIG+MIG焊接接头组织与性能
9.VMAP VIA Modular Architecture PlatformsVIA模块架构平台
10.Web Service on the JXTA;JXTA平台下的WEBSERVICE
11.Control of Steward Platform with PIDNN;Steward平台的PIDNN控制
12.movable work platforms可动工作平台 可动工作平台
13.offshore drilling platform海上钻井平台近海钻探平台
14.Platforms : Displays a list of platforms for the current project.平台:顯示目前專案的平台清單。
15.Platform for Internet Content Selection因特网内容选择平台(内选平台)
16.A platform at the top of a ship's foremast.前桅楼,前桅平台轮船前桅顶部的平台
17.Development of Simulation Testing Platform in MIMO System;MIMO仿真平台与硬件试验平台研制
18.The Research and Implementation of Hardwire Kit for Bluetooth Development Kit;蓝牙开发平台硬件平台的研究与实现
相关短句/例句

tension leg platform (TLP)张力腿平台(TLP)
3)TLP bondingTLP焊
1.Preparation and welding performance of amorphous interlayer alloys for TLP bondingTLP焊用非晶态中间层合金的制备及焊接性能
4)TLP bondingTLP连接
1.The TLP bonding was carried out at 1230℃ for 8 h in vacuum.采用Ni-Cr-B非晶中间层瞬间液相连接(Transient liquid phase bonding)一种镍基单晶高温合金DD98,TLP连接在1230℃,8h真空条件下进行。
5)TLP diffusion bondingTLP扩散焊
1.TLP diffusion bonding of the IC10 directional-solidfication superalloy was studied.对定向凝固高温合金IC10进行了TLP扩散焊,中间层合金为在母材成分基础上加入一定量的降熔元素B配制而成,研究了在1270℃不同保温时间下焊缝及母材组织的变化,并对焊缝及母材中γ′相的形状尺寸变化进行了分析。
6)TLP technologyTLP技术
延伸阅读

[3-(aminosulfonyl)-4-chloro-N-(2.3-dihydro-2-methyl-1H-indol-1-yl)benzamide]分子式:C16H16ClN3O3S分子量:365.5CAS号:26807-65-8性质:暂无制备方法:暂无用途:用于轻、中度原发性高血压。