结合界面,bonding interface
1)bonding interface结合界面
1.Bonding ability of TA2 and 316L plates with explosion cladding was evaluated,the microstructure and composition of the bonding interface was investigated by SEM,EDS and XRD.结果表明,结合区形貌呈波状,结合界面附近形成细晶区;结合区存在不连续的熔合层,该层含有大量金属基体小碎块和合金化后生成的金属间化合物,并产生了裂纹、气孔,且波状结合界面不同位置组织成分分布不均匀等焊接缺陷;两基板之间发生了元素扩散;拉剪实验各项性能满足复合材料使用要求,拉伸后波状界面发生了分离。
2.(1)We have found and defined three kinds of bonding interfaces:big wavy,small wavy and micro wavy,and the micro wavy interface is the best,in a cladding plate,it is for the first time to find that the form of interface presents regular distribution.爆炸焊接理论与技术取得了四个方面的进展:(1)发现并重新定义了三种结合界面:大波状、小波状和微波状,其中以微波状为最佳。
3.The bonding interface of TA1/Q235 and the diffusion of Ti and Fe are investigated by the manufacture of TA1/Q235 with ARB process.通过TA1/Q235的累积叠轧焊,研究TA1/Q235复合板结合界面组织和Ti与Fe两元素的扩散情况。
英文短句/例句

1.Reserch on Nonplanar Interfaces Formed by Transient Liquid Phase Diffusion Bonding Process瞬时液相扩散连接非平面结合界面的研究现状
2.Histological Research of the Microscrew Implant-bone Interface;微螺钉种植体—骨结合界面组织形态的实验研究
3.Study of the TA1/Q235 clad plate's interface structure and bonding characteristicsTA1/Q235钢复合板界面结构与结合特性
4.The influence of rolling speed is not distinct.轧制速度对界面结合的影响不明显。
5.Experimental Study on the Integration between LARS Artificial Ligament and Bone InterfaceLARS人工韧带与骨界面结合的研究
6.Study on interfacial bond property of aramid fiber-reinforced composite material芳纶纤维复合材料界面粘结性能研究
7.TEM study on the interface of microcellular composite微胞结构复合材料界面的TEM研究
8.A Study of Data Transfer over the Coupling Interfaces of Fluid-structure Interaction流体-结构耦合界面的数据传输研究
9.Recrystallization on Interface between NiCoCrAlYTa Coating and Nickel-Based Super-AlloyNiCoCrAlYTa涂层/镍基单晶高温合金界面再结晶
10.HRTEM Study of Interface Structure in Al_2O_3/2024Al CompositeAl_2O_3/2024Al复合材料界面结构的HRTEM研究
11.Love Waves in ZnO-SiO2-Si Piezoelectric Layered Structures with Imperfect Interfaces弱界面ZnO-SiO_2-Si压电层合结构中的Love波
12.THE ADHESION AND THE FRACTURE ENERGY AT THE TNTERFACE OF COMPOSITES OF ARAM ID FIBER WITH ACTIVE SKIN LAYER表面改性芳纶复合材料的界面粘结与界面断裂韧性
13.The composite features, the elements diffusion and the binding strength in interface of the adaptor have been reviewed.考察了接头的界面复合特征,界面上元素扩散及接头的结合强度。
14.THE EFFECT OF INTERFACE BONDING STRENGTH OF C/Al COMPOSITES ON TENSILE STRENGTH碳/铝复合材料界面结合强度对拉伸性能的影响
15.Interfacial Structure and Cohesion Strength of Kovar--Cu Composite可伐合金与铜复合材料界面结构和强度的研究
16.Study on the Interfacial Microstructure and Microchemistry of Short Mullite Fiber Reinforced Aluminium-based Composites;Mullite/AI合金复合材料界面微结构及微成分研究
17.Study on Microstructure of Ni-based Alloy;镍基自熔合金复合材料界面微观结构研究
18.Study on the Interfacial Structure of Inorganic Particles/polymer Nanocomposites纳米无机粒子/聚合物复合材料界面结构的研究
相关短句/例句

interface[英]['?nt?fe?s][美]['?nt?'fes]结合界面
1.The interface between Ga_(95.15Sn合金与Cu基体的结合界面进行了分析。
3)interfacial bonding界面结合
1.The reason is believed to be the improved interfacial bonding.研究表明,在碳化硅复合材料表面化学镀一层镍,能够较好地改善增强体与基体的界面结合,使得碳化硅复合材料的抗弯强度、冲击韧性及宏观硬度均有了明显的提高。
2.The fracture surface of the wires studied by scanning electron microscopy (SEM) shows a suitable interfacial bonding between the fiber and aluminum.复合丝拉伸断口的扫描电镜(SEM) 观察可见断面有一定起伏,部分纤维拔出但长度较短,表明纤维与基体具有适当的界面结合。
3.Al/Diamond composites were fabricated by Spark Plasma Sintering(SPS) under Solid-phase sintering,changes of interfacial bonding during sintering process were investigated mainly.使用放电等离子烧结(SPS)固相烧结条件下制备Al/Diamond复合材料,重点研究烧结过程中基体与增强体两相界面结合状态随烧结时间的变化规律。
4)interface bonding界面结合
1.The changes of the surface smooth degree and the interface bonding after the level off rolling were investigated.研究了高温平整轧制前后钢带表面平整度及界面结合情况的变化 ,并进一步探讨了轧制参数对界面结合强度的影响·分析了带坯复合界面的演化机理·结果表明 :平整轧制可明显改善钢带表面的平整度 ,提高界面结合强度 ;轧制温度、轧制压下量等工艺参数对界面结合有较大影响 ,而轧制速度影响不大 ;平整轧制时 ,反向凝固带坯复合界面发生演化 ,使界面结合增强 ,其机理为咬合机制、互扩散机制及固溶作用机制
2.The influence of laser power and scanning velocity on interface bonding between clad layer and substrate and uniformity of microstructure in composite surface layer was studied.研究了激光功率、扫描速度对原位合成TiCp/Al表层复合材料与基底的界面结合和熔覆层组织均匀性的影响。
3.In this paper, it is mainly from dispersion and interface bonding point of view suggested that the multi-walled carbon nanotubes (MWNTs) were filled into polymer matrix.本文主要从分散和界面结合的角度出发研究了多壁纳米碳管(MWNTs)与聚合物的复合,通过对复合材料微结构和力学性能的表征,分析了碳管在聚合物中的作用机理。
5)interface binding界面结合
1.This paper is focused on improving the interface bonding strength of hard grain phase and copper alloy matrix in the WC particle reinforced composite to raise its wear resistance, and revealing the relationship between the wear resistance and interface binding, the wear resistance and microstructure, and the wear resistance and abrasion mechanism.为了提高硬质颗粒复合合金材料的耐磨性并揭示其与界面结合、微观组织及磨损机理之间的关系,本文设计并通过钎焊法,在普通铸钢件表面制得了厚度可达30mm的WC颗粒增强铜基合金覆层,测试分析了上述各种因素对此覆层耐磨性的影响。
6)interface combining界面结合
1.The result shows that the low the humidity is,the better the interface combining effect is.研究不同湿度预处理对新老混凝土的结合影响,采用拉拔试验及显微硬度评价界面结合效果。
2.The mechanism of the interface combining of cement & fly ash composite sandwich panels is discussed.以聚苯乙烯泡沫塑料板、水泥、粉煤灰、增强纤维和外加剂为主要原料生产的水泥/粉煤灰复合夹芯墙板,具有节能保温效果优异和工业废物粉煤灰利用率高的特点,初步探讨水泥/粉煤灰复合夹芯墙板的界面结合机理。
延伸阅读

非结合环与非结合代数非结合环与非结合代数on-associative rings and algebras 非结合环与非结合代数【珊心胭仪妇柱视血娜.d alge-b旧s;。eaceo””姗.oe.二、双a.幼。6P。」 具有两个二元运算+与,,除了可能不满足乘法结合律外,满足结合环与代数(a洛。clati记nn邵and目罗b璐)之所有公理的集合.非结合环与代数的第一批例子出现在19世纪中叶,是不结合的(Ca外呀数(c盯触yn山n1比IS)和更一般的超复数(h”姆rComp恤nUmber)).给定一个结合环(代数),如果用运算〔a,bl二ab一ba代替原有的乘法,其结果是一个非结合环(代数),这是个Lie环(代数).另一类重要的非结合环(代数)是Jo攻lan环(代数),它们可由在特征非2的域(或有1和1/2的交换的算子环)上的结合代数中定义运算a·b=(ab+ba)/2得到.非结合环与代数的理论已经发展成代数学的一个独立分支,展现出与数学的其它领域以及物理学、力学、生物学及其他学科的许多联系.这个理论的中心部分是熟知的拟结合环和代数(n比ly一别粥戊泊石wn刀乡缸记a】罗bras)的理论,它们有:Lie环和珠代数,交错环和交错代数,北攻坛幻环与Joltlan代数,MaJ几哪B环和Ma月五U口B代数,以及它们的某些推广(见Ue代数(Lieal罗bra);交错环与代数(司加叮必tiverm邵alld目罗b挑);J加止川代数(Jo攻协nal罗bIa);M幼城e。