封装性,encapsulation英语短句,例句大全

封装性,encapsulation
1)encapsulation[英][in,k?psju'lei??n][美][?n,k?ps?'le??n]封装性
1.Encapsulation, inheritance and polymorphism are its features.介绍了软件工程领域的技术同实际应用相结合的具体方法,面向对象技术是当今的主流软件开发方法,它具有封装性、继承性和多态性。
2.Class,as an abstract conception,has three characteristics: inheritance,encapsulation and polymorphism,which can be comprehended easily in the field of theory by beginners but may be more difficult in practical process.类作为一个抽象的概念具有三大特性,即封装性、继承性和多态性。
2)performance of this LED package封装性能
1.Discussed are the crucial components for the performance of this LED package as the underlying chip technology, the suitable package design and the fitting primary optics.讨论与此种LED封装性能密切相关的议题:基础的芯片技术、合适的的封装设计和初级光学元件。
3)Package reliability封装可靠性

英文短句/例句

1.Thermal-Mechanical and Hygroscopic Characteristics of Micro-electronic Packaging Polymer and Its Packaging Reliability Study;微电子封装高聚物热、湿—机械特性及其封装可靠性研究
2.The Reliability Analysis and Structure Parameter Opimization of Stacked Die Package;叠层芯片封装可靠性分析与结构参数优化
3.Vibration Analysis and Reliability Research of Packaging on LTCC SubstrateLTCC基板的振动分析及其封装可靠性研究
4.Improving the Reliability of Power MOSFET Package提高MOS功率晶体管封装可靠性技术研究
5.Comparative Research of Micro-BGA Reliability Under Bending Stress弯曲应力状况下微型BGA封装可靠性比较
6.Impact of Hot-Cutting Defect on Reliability of Ceramic Packaging and a Novel Concept of Structure Design;热切缺陷对陶瓷封装可靠性的影响和一种结构设计新概念
7.Finite element analysis on soldered joint reliability of QFN deviceQFN封装焊点可靠性的有限元分析
8.Reliability Analysis of PBGA Devices at Hygrothermal EnvironmentPBGA封装的耐湿热可靠性试验研究
9.Reasearch on Encapsulation Technology Reliability of High Power White-Light LED大功率白光LED封装技术可靠性研究
10.Reliability of SOP Component Solder Joint小尺寸封装(SOP)器件焊点可靠性研究
11.Effect of Hydrogen on the Reliability of Microelectronic Devices氢对金属封装密封元器件可靠性的影响
12.Study on the Reliability of SMT Solder Joint in Electronic Packaging;电子封装中表面贴装焊点的可靠性研究
13.Moisture Absorption Property of Material and Moisture&Thermal Affects on Package's Reliability封装材料的吸湿特性及湿、热对封装器件可靠性的影响
14.Kiln head seal person who adopts clamshell seal, kiln tail equips with the contact-type sealinstallation of the axial, have guaranteed sealed dependability.窑头密封采用了壳罩式密封，窑尾装有轴向接触式密封装置，保证了密封的可靠性。
15.Interfacial Reaction and Reliability in Lead-free Electronics Packaging;无铅电子封装中的界面反应及焊点可靠性
16.Research on Reliability of Au80Sn20 Solder Joint for Laser Diode Packages;在激光二极管LD封装中Au80Sn20焊点的可靠性研究
17.Interfacial Evolution and Reliability of Lead-Free Solder Joints for Electronic Packaging;电子封装中无铅焊点的界面演化和可靠性研究
18.A Study on Interface Failure Analysis and Reliability for High Temperature Electronic Packaging高温电子封装界面失效分析及可靠性研究