TiO2/SiO2,TiO_2/SiO_2Ó¢Óï¶Ì¾ä,Àý¾ä´óÈ«
´ò°ü»ú,BalerÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ѹÖƳÉÐÍ,CompactionÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
¾ÛÒì±û»ù±ûÏ©õ£°·,poly(N-isopropylacrylamide)Ó¢Óï¶Ì¾ä,Àý¾ä´óÈ«
·´ÌúµçÌå,antiferroelectricsÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
¾Û°±õ¥õ£ÑÇ°·,polyurethane-imideÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÔÓ»¯Îï,hybridÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
1,2-¶þäåÒÒÍé,1,2-dibromoethaneÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÈÛÌå·ÄË¿,melt spinningÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÄÉÃ׳ߴç,nano-sizeÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Ê®°ËÍé»ùÈýÂȹèÍé,octadecyltrichlorosilaneÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÄÉÃ×¾§Á£,nanoparticleÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÄÉÃ×ÃÉÍÑÍÁ,nano-montmorilloniteÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
·´ÉäÐÔ,reflectionÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÔÓÝÁÁª±½¾ÛÃÑí¿Íª,PPESKÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ä廯¶¡»ùÏð½º,brominated butyl rubberÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
¼×»ù±ûÏ©Ëáп,zinc methacrylateÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÄÉÃ×ð¤ÍÁ,nano-clayÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÄÉÃ×Öù,nanorodsÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Ä£ÇÐ,die-cuttingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
1,3-±û¶þ°·,1,3-propanediamineÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
µçÔÙÉú,electro-regenerationÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Բ׶Ãæ,coneÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÄÉÃ×MgO,nano-MgOÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÓÐÐòÕóÁÐ,ordered arrayÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
²ð½â,dismantlingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
¹²»ì·¨,blending methodÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Òì²½´®ÐÐͨÐÅ,asynchronous serial communicationÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Bi2Te3,Bi_2Te_3Ó¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Mo5Si3,Mo_5Si_3Ó¢Óï¶Ì¾ä,Àý¾ä´óÈ«
×ÏÍâÆÁ±Î,UV-shieldingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Ti2AlC,Ti_2AlCÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
¾Û±½°·(PANI),Polyaniline(PANI)Ó¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÄÉÃ×µã,NanodotÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
΢Ã×°ô,microrodÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
½ðÊôÒø,silverÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÁÑÎÆȱÏÝ,Crack defectÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
³¬´óÐÍ,super-largeÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Æøѹ´«¶¯,Pneumatic transmissionÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
¿¹ÄýѪÐÔÄÜ,AntithrombogenicityÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÈÈÕ³µ¯ÐÔ,thermoviscoelasticityÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
×Ó×°ÅäÌå,subassemblyÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÉϽº,sizingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Éø͸Æû»¯Ä¤,pervaporation membraneÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
²ÃÇÐ,cuttingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
×Ô¼«»¯,Self-polarizationÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Í»ù·ÛÄ©Ò±½ð,Cu-PMÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Áòϵ»¯ºÏÎï,chalcogenideÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
½ð¹¤,MetalworkingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
³¬Éùµç³Á»ý,ultrasonic-electrodepositingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÄÉÃ×΢ÄÒ,nanosphereÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
×ÏÍâ¹â¿Ì,UV-lithographyÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Áù·½Ïà,hexagonalÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
¸ñÕ¤,gridÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
΢Á¿Á¿ÈÈ,microcalorimetryÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
·´Ó¦×°ÖÃ,reactorÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Áù½ÇÐÎ,hexagonalÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
°±»ù¹èÍé,AminosilaneÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Ô¤Ðͼþ,preformÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÀÛ¼ÆÁ¿,CumulantÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
½ôÃܶÈ,affinityÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Æø¶¯Ê½,pneumaticÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÈÈÈí»¯,thermo-softeningÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÎüÆø,inspirationÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
´ß»¯ÐÔ,catalyticÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
¾Ñéģ̬·Ö½â(EMD),empirical mode decomposition(EMD)Ó¢Óï¶Ì¾ä,Àý¾ä´óÈ«
»¥Ò×ÔÀí,reciprocity theoremÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ð¤½Ó¼Á,AdhesiveÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ȼÆøÈȱÃ,gas heat pumpÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
³¬¿Õ»¯,supercavitationÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÈÈ»úµçñîºÏ,PiezothermoelasticityÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÈÈÉù,thermoacousticÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
¹ìµÀ°å,slabÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÉäƵµÈÀë×ÓÌåÔöÇ¿»¯Ñ§ÆøÏà³Á»ý,RF-PECVDÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
×Ô¶¥ÏòÏÂÉè¼Æ,top-down designÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
¼«¸ßÕæ¿Õ,XHVÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ʱÓòÃÅ,time-gateÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
µ¼Á÷ÕÖ,DomeÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Çé¸Ð»¯,emotionÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ºÐ×Ó,boxÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÄÉÃ×ÖÆÀä¼Á,nanorefrigerantÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
¿×¶´ÐÞ²¹,hole repairingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
·ÇÕôÉ¢ÐÍÎüÆø¼Á,NEGÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÀäÄýÕô·¢Æ÷,condenser-evaporatorÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
¸ÉÉæºÏ³É¿×¾¶ÉùÄÉ,InSASÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÍâÈÚ±ù,external-meltÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
¸ÐÊÜ,feelingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÓïÒâ,meaningÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÉîÀä,cryogenicÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
OÐλ·,O-ringÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ϵͳ±ê¶¨,system calibrationÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÕýÏÒ,SineÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
×éÔª,componentÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
×ÔÓɵøÂä,Free-dropÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
¹âȦ,apertureÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÒøÄ»,screenÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÖÆÀä¼ÁÌæ´ú,alternativeÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Âë¶â,palletizingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÑÇÃÌËáÑÎ,manganiteÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
¶þ²æÅж¨Í¼,Binary decision diagramÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
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